Conductive and magnetic adhesive formulations

SY-11 glue
Component dosage /g component dosage /g
E-51 epoxy resin 100 silver powder 200-260
Triethanolamine 15   
Preparation and curing   Weigh in order and mix evenly. Adhesive pressure 0.05MPa , curing 3 hours at 12 °C or 6h at 80 °C.
use   The adhesive is used in conductive adhesive bonding, such as piezoelectric crystals, printed circuits, waveguides, carbon brushes, and ultrafine metal wire bonding.
DAD-4 glue
Component dosage /g component dosage /g
A , zinc phenolic resin 4.5 solvent 20.5
Polyvinyl acetaldehyde 3.5 B , 2- ethyl. =4 Methylimidazole 0.24
E-44 Epoxy Resin 1.5 C , Reduced Silver Powder 20.0
Preparation and curing   First prepare the A component, mix well, and add the B and C components. Curing: The pressure is 49kPa , 1h at 80 °C, and 4h at 130 °C.
use   The glue has high heat resistance and can be used for conductive bonding in the radio industry.
 
 
 
 
Preparation and curing   Weigh in order and mix well. Curing at 50 °C pressure, 100 °C /8h .
use   The glue is used for bonding conductive parts of electronic components instead of soldering and silver brazing. Good resistance to aging and media resistance.
Epoxy conductive adhesive
Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Ethanolamine 7
Dioctyl phthalate 5-15 reduced silver powder ( 300 mesh) 200-250
Has diamine 7   
Preparation and curing   Epoxy resin and dioctyl phthalate were mixed and then silver powder was added. After the mixture was homogenized, diamine and ethanolamine were added, and the mixture was ready for bonding. After being glued and glued, it was allowed to stand at room temperature for 5 hours , then at 80 °C for 1 hour , and then at 130 °C for 2 hours , it was completely cured.
use   The adhesive has good adhesive strength and conductive properties and can be used instead of soldering for the bonding of aluminum, copper and other electrical components. The use temperature is -50-60 °C .
DAD-7 glue
Component dosage /g component dosage /g
E-51 Epoxy Resin 70 KH-560 2
W-95 epoxy resin 30 phenylenediamine 20
Carboxyl terminated liquid nitrile rubber 15 2- ethyl- 4 methyl imidazole 3
Polyvinyl butyral 5 reduction silver powder 300
600# Thinner 10   
Preparation and curing   Weigh in order and mix well. Curing: Preheat at 80 °C for 30 min , at pressure 49kPa , 160 °C for 3h .
use   The glue is used for bonding and instrument assembly of various electronic instrument components and is used at -60-100 °C .
501 epoxy adhesive
Preparation and curing   The 647 # anhydride is heated and melted first, and then weighed according to the amount to be formulated. Curing conditions are 3 hours at 120 °C.
use   The glue is resistant to ethanol, B, engine oil, 3% NaCl , and its strength is unchanged for one month. Used for the bonding of conductive elements.
Anchor 401
Component dosage /g component dosage /g
A , polyester resin 1 C , silver powder 10
B. Modified TDI solution 4   

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